Loaded-board, guided-probe test fixture

ABSTRACT

A guided-probe test fixture is disclosed for connecting circuit cards having electronic components to a board test system. The test fixture utilizes long, leaning or vertical test probes, guide plates and limited probe tip travel in order to achieve high-accuracy, fine-pitch probing of limited-access, no-clean test targets. The guided-probe test fixture of the present invention also utilizes spring probes, probe-mounting plates, personality pins and an alignment plate in order to couple test targets with multiplexed tester resources. The guided-probe test fixture of the present invention may also utilize a universal interface plate with double-headed spring probes and/or a wireless interface printed circuit board to facilitate the electrical coupling of test targets to tester resources. Accordingly, the guided-probe test fixture of the present invention is capable of sophisticated in-circuit and functional testing of a loaded-printed circuit board containing both standard-access and limited-access, no-clean test targets. The present invention is also capable of improved probing accuracy, improved no-clean testability and improved fine-pitch probing of limited-access test targets, while at the same time capable of probing standard-access test targets.

FIELD OF THE INVENTION

The present invention relates generally to the field of test equipmentfor testing printed circuit boards, and more particularly to board testfixtures and other mechanical interfaces for electricallyinterconnecting electronic circuit cards having electronic componentsand the like to the interface probes of a loaded-board tester.

BACKGROUND OF THE INVENTION

Loaded-Board Test Fixtures

After printed circuit boards (PCB's) have been manufactured and loadedwith components, and before they can be used or placed into assembledproducts, they should be tested to verify that all required electricalconnections have been properly completed and that all necessaryelectrical components have been attached or mounted to the board inproper position and with proper orientation. Other reasons for testingprinted circuit boards are to determine and verify whether the propercomponents have been used and whether they are of the proper value. Itis also necessary to determine whether each component performs properly(i.e., in accordance with the specification). Some electrical componentsand electro-mechanical components also may require adjustment afterinstallation.

Loaded-board testing has complex multiplexed tester resources and iscapable of probing soldered leads, vias and testpads on loaded boardswith topside and bottom side components. Loaded-board testing includesanalog and digital tests, such as tests for electrical connectivity,voltage, resistance, capacitance, inductance, circuit function, devicefunction, polarity, vector testing, vectorless testing, and circuitfunctional testing. Loaded-board testing requires very low contactresistance between the test targets and the fixture components.

Advances in circuit board and electronic component packaging technologyhave escalated the probe spacing demands placed on loaded-board testequipment. Existing state-of-the-art technology requires loaded-boardtest equipment capable of accessing test targets which are spaced apartby 50 mils (center to center) or less, where test targets are physicalfeatures on a PCB or electronic component which may be probed duringtesting. One of the greatest challenges faced by loaded-board testequipment manufacturers now and in the future is a high false failureand test malfunction rate caused by physical and electrical contactproblems. These problems are exacerbated by existing fixture limitationsin probing accuracy, probing pitch (center to center spacing), andsurface contamination.

As component and board geometries shrink and become denser, loaded-boardtesting becomes more difficult using standard fixtures. Existingshortwire, loaded-board fixtures can consistently hit test targets equalto or greater than 35 mils in diameter with equal to or greater than75-mil pitch. Targets which are smaller or more closely spaced cannot beprobed with consistency due to prohibitive component and systemtolerance stack-ups.

A variety of test fixtures have heretofore been available for testingloaded boards on test equipment. A device under test (DUT) typicallyembodies a PCB loaded with electronic components and electronichardware. FIG. 1 shows a conventional shortwire, loaded-board fixture,which consists of a DUT 108 with outer-layer artwork, a standard 106 orvariable 118 tooling pin for alignment, a probe protection plate 104,standard spring probes 120 whose tips 116 exactly correspond to testtarget locations 110 and 112, spacers 114 to limit the deflection of theDUT under vacuum loading, a probe-mounting plate 102 in which the springprobes 120 are installed, personality pins 100 which are wired to thespring probes 120, and an alignment plate 122 which aligns the wirewraptails of the personality pins 100 into a regularly spaced pattern sothat they can line up with interface probes 124 mounted in the tester(not shown). Note: a spring probe is a standard device, commonly used bythe test community, which conducts electrical signals and contains acompression spring and plunger that move relative to the barrel and/orsocket when actuated. A solid probe also conducts electrical signals buthas no additional parts which move relative to each other duringactuation.

During test, the DUT 108 is pulled down by via vacuum or other knownmechanical means to contact the tips 116 of the spring probes 120. Thesockets of the standard spring probes 120 are wired to personality pins100, and an alignment plate 122 funnels the long, flexible personalitypin tips 126 into a regularly spaced pattern. The tips 126 ofpersonality pins 100 contact the interface probes 124 located in thetester (not shown). Once electrical contact between the DUT 108 and thetester is established, in-circuit or functional testing may commence.Hewlett-Packard Company Application Note 340-1 titled "ReducingFixture-Induced Test Failures," (printed December 1990 and can beobtained from Hewlett-Packard Company in Palo Alto, Calif.), disclosesshortwire fixturing and is incorporated herein for all that it teaches.U.S. Pat. No. 4,771,234 titled "Vacuum-Actuated Test Fixture" by Cook etal. discloses a longwire fixture and is incorporated herein for all thatit teaches.

FIG. 2 shows one conventional fixture that attempts to addresslimited-access problems during testing. The term "limited-access" refersto something that cannot easily be reached, or accessed, due to physicalrestrictions or constraints. For example, a limited-access PCB maycontain many targets that are too closely spaced to accurately probeusing existing fixture technology. The term "standard-access" refers tothat which can be reached, or accessed, using existing fixturetechnology. The fixture of FIG. 2 consists of a DUT 206 with testpads208 and 210, a tooling pin 204, a probe protection plate 202, standardspring probes 214 and 216 installed in a probe-mounting plate, and shortprobes 212 and 220 commonly referred to as "ULTRALIGN" probes (Ultralignis a registered trademark of TTI Testron, Inc.) installed directly inthe probe protection plate. Upon actuation, standard spring probes 216and 214 located in the probe-mounting plate push against the floatingplungers of "ULTRALIGN" probes 212 and 220. These short plungers areforced upward to contact test targets 208 and 210, while the sockets 218and 222 remain fixed within the probe protection plate 202. An"ULTRALIGN" fixture may contain a mixture of spring probes for probingstandard-access targets and "ULTRALIGN" probes for probinglimited-access targets.

Despite its potential benefits, the "ULTRALIGN" fixture can be expensiveand does not probe targets with a pitch of less than 50 mils. An"ULTRALIGN" fixture only permits limited probe travel which may resultin poor connectivity between the probes 212 and 220 and the test targets208 and 210. Also, these probes are costly and require expensivemaintenance to replace worn or broken "ULTRALIGN" probes. An example ofthis type of fixture is disclosed in U.S. Pat. No. 5,510,772 entitled"Test Fixture for Printed Circuit Boards" to Seavey, which isincorporated herein for all that it teaches.

FIG. 3 shows a conventional guided-probe protection plate fixture.Guided-probe protection plates are used in standard loaded-board testfixtures to improve the pointing accuracy of spring probes. These platescontain cone-shaped through-holes which guide, or funnel, the tips ofspring probes toward test targets. Such a fixture consists of aprobe-mounting plate 300 with standard spring probes 312 and 314, aguided-probe protection plate 302 with spacers 310 and cone-shaped holes316 for guiding the spring probes to the test targets 306 and 308 on theDUT 304. Additional manufacturing steps and increased fixturemaintenance are required due to increased wear on the probes and theprobe protection plate, and generally only narrow probe tip styles canbe used. Although probing accuracy is slightly enhanced with thismethod, targets with center-to-center spacing of less than 75 milscannot be probed reliably.

Bare-Board Test Fixtures

Bare-board testing probes testpads, vias, and plated through holes onbare printed circuit boards only and tests for electrical connectivityand continuity between various test points in the circuits on theprinted circuit boards before any components are mounted on the board. Atypical bare-board tester contains test electronics with a huge numberof switches connecting test probes to corresponding test circuits in theelectronic test analyzer.

While loaded-board testing can determine an electronic component'sexistence, proper orientation, or functionality, bare-board testing onlychecks for electrical continuity on PCB's without components. Bare-boardtesting does not require the very low contact resistance thatloaded-board testing requires, nor does bare-board testing utilizesophisticated and complex multiplexed tester resources which must beassigned to specific targets and circuits on the device under test.

In previous years, PCB's were designed and manufactured so that theirfeatures resided in a regularly spaced pattern. During testing, the PCBwas placed directly atop a regularly spaced pattern of interface probeslocated in the tester. As PCB and component geometries shrunk, PCBfeatures could no longer be placed in a regularly spaced pattern andprobed directly by interface probes. A bare-board fixture was developedwhich utilized long, leaning solid probes to provide electricalconnections between small, closely spaced, randomly located targets onthe PCB and regularly spaced interface probes located in the tester.Circuit Check, Inc. (Maple Grove, Minn.), Everett Charles Technologies(Pomona, Calif.), and Mania Testerion, Inc. (Santa Ana, Calif.), amongothers, make bare-board test fixtures which are commonly used onbare-board testers today.

Although each bare-board fixture builder uses unique components andmanufacturing processes, most bare-board fixtures resemble FIG. 4 andinclude regularly spaced spring probes 414 on a tester and long, solidtest probes 402 and 416 inserted through several layers of guide plates400 drilled with small through-holes and held in a spaced-apart fashionwith spacers 410. The bed of standard spring probes 414 actuate thesolid test probes 402 and 416. The long, solid probes may be insertedinto the guide plates vertically or at an angle in order to facilitatean easy transition between the fine-pitch, or very close, spacing oftestpads 404 and 406 on the PCB side of the fixture and the larger-pitchspacing of the spring probes on the tester side of the fixture. One suchbare-board fixture is disclosed in U.S. Pat. No. 5,493,230 titled"Retention of Test Probes in Translator Fixtures" to Swart et al., whichis incorporated herein for all that it teaches.

Existing bare-board fixtures can consistently hit test targets equal toor greater than 20 mils in diameter with equal to or greater than 20-milpitch (center-to-center spacing). Unfortunately, it is not possible touse bare-board fixtures directly on a loaded-board tester because thereare many unique features which render bare-board test equipment directlyincompatible with loaded-board test equipment.

Bare-board fixtures are not designed to accommodate PCBs which arepopulated with electronic components; only PCB features which are flushwith respect to the PCB (pads, vias, and plated through holes) can beprobed. Bare-board testers are used to determine the connectivity andcontinuity of test points and circuitry in a PCB. Unlike bare-boardtesters, loaded-board testers cannot tolerate higher electricalresistance between a target on a PCB and the tester electronics.Loaded-board fixtures must provide low-resistance connections andinterfaces between targets, fixture components, and tester electronics.Unlike loaded-board testers, bare-board testers cannot determine whethera component or a group of components exists and functions properly.

The spacing of bare-board tester interface probes is approximately 0.050inches by 0.050 inches or 0.100 inches by 0.100 inches, while thespacing of Hewlett-Packard's tester interface probes is approximately0.150 inches by 0.350 inches. The probe spacing of bare-board fixtureswhich are designed to fit on bare-board testers is not compatible withthe interface probe spacing of Hewlett-Packard's loaded-board tester.Bare-board fixtures translate a target on the PCB under test to thenearest interface probe in the bare-board tester. However, loaded-boardtester resources must be uniquely assigned and linked to specifictargets and circuits. In loaded-board testing, the nearest interfaceprobe may not be appropriate for a given target. Bare-board fixtures arenot able to provide unique electrical routing to adjacent, nonadjacent,and remote tester resources; cannot reach remote resources; and cannotprovide the complex, loaded-board resource routing patterns required bya loaded printed circuit board.

The term "no-clean" refers to the non-conductive solder flux residuewhich remains on printed circuit assemblies after components have beenattached. Unless this contamination is removed, no-clean targets, ortargets which are coated with this non-conductive surface residue,provide poor electrical contact and are difficult to test. Furthermore,industry trends, such as smaller component packaging and denser PCBs,are forcing electronics' manufacturers to confront smallercenter-to-center target spacing, and small-diameter targets. Thesechallenges require an improved loaded-board test fixture that is capableof providing reliable, consistent in-circuit and circuit functionaltesting of printed circuit assemblies by probing the smaller, moreclosely spaced targets on today's no-clean, loaded printed circuitboards, while at the same time probing vias and testpads onloaded-boards with top and bottom-side components and testing forelectrical connectivity, voltage, resistance, capacitance, inductance,circuit function, device function, polarity, vector testing, vectorlesstesting, and circuit functional testing.

Loaded-board equipment manufacturers and fixture builders have designedseveral accessories and products to improve the testability of small,fine-pitch targets, but no design has completely solved the physical andelectrical contact problems, while remaining competitively priced andeasy to build and maintain. There is a need for such an improvedloaded-board, guided-probed test fixture that solves physical andelectrical problems related to limited-access testing, is competitivelypriced, accommodates the sophisticated resource assignments required byloaded-board testing, and is relatively easy and inexpensive to buildand maintain. There is a further need for such an improved loaded-board,guided-probe test fixture that has improved probing accuracy, improvedno-clean testability, and improved fine-pitch probing ability.

SUMMARY OF THE INVENTION

In accordance with the present invention there is provided a boardfixturing system for interfacing a printed circuit board havingelectronic devices at predetermined locations thereon to one or moreprobe mounting plates having electrical contacts at predeterminedlocations corresponding to the locations of the electronic devices onthe printed circuit board. The board fixturing system comprises: aguided-probe high-accuracy, high-density test system consisting of adevice under test (DUT) with outer-layer artwork, some method ofDUT-to-fixture alignment, several guide plates with unique offsetdrilled through-hole patterns, test probes and tester interface probes.Long, leaning or vertical test probes are used in order to facilitate aneasy transition between fine-pitch targets on the DUT and thelarger-pitch targets on the probe-mounting plate or wireless PCBfixture.

The loaded-board, guided-probe test fixture of the present inventionutilizes long, leaning or vertical test probes, probe-guiding plates andlimited probe tip travel to achieve high-accuracy, fine-pitch probingand utilizes spring probes, a probe-mounting plate, personality pins, analignment plate or wireless PCB fixture to couple test targets withmultiplexed tester interface probes of a loaded-board tester. Theprobing accuracy of the system is enhanced by guided probe tips, a shortprobe stroke, and limited tip extension beyond the top of the guideplate. In addition, the ability of the system to probe no-clean targetsis enhanced by high spring force probes and the wiping or scraping ofthe tips of leaning solid probes across the targets during actuation.

The loaded-board, guided probe test fixture of the present invention hasimproved probing accuracy due to reduced fixture and componenttolerances, improved no-clean testability due to the probe wiping action(the wiping of the tips of the solid probes across the targets) and highspring force probes, and improved ability to probe fine-pitch targetsdue to reduced component dimensions.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the presentinvention will be better understood by reading the following moreparticular description of the invention, presented in conjunction withthe following drawings, wherein:

FIG. 1 shows a cut-away view of a conventional shortwire test fixture;

FIG. 2 shows a cut-away view of a conventional ultra-alignment testfixture;

FIG. 3 shows a cut-away view of a conventional guided-probe protectionplate;

FIG. 4 shows a cut-away view of a conventional bare-board translatortest fixture;

FIG. 5 shows a cut-away view of first and second embodiments of aloaded-board, guided-probe test fixture according to the presentinvention;

FIG. 6 shows a cut-away view of a third embodiment of a loaded-board,guided-probe test fixture according to the present invention;

FIG. 7 shows a cut-away view of a fourth embodiment of a loaded-board,guided-probe test fixture according to the present invention; and

FIG. 8 shows a cur-away view of fifth and sixth embodiments of aloaded-board, guided-probe test fixture according to the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to the schematic block diagram of FIG. 5, a first and a secondembodiment of a loaded-board, guided-probe test fixture of the presentinvention are shown. The test fixture of the first embodiment comprisestwo major assemblies. The first assembly 540 is a translator fixturecomprising a series of vertically spaced-apart and parallel guide plates516, which are supported in parallel by solid posts 522 that hold thefixture together as a solid unit. The fixture also includes an array ofleaning probes 526 extending through guide holes in the translator guideplates 516. The leaning probes 526 are in alignment on a first side ofthe translator fixture 540 with test targets 520 of a loaded circuitboard 518. The leaning probes 526 are in alignment on a second side ofthe translator fixture 540 with spring probes 514 on a first side of aprobe-mounting plate 524. The long leaning probes 526 are used tofacilitate an easy transition from the fine-pitch targets 520 on thedevice under test 518 and larger pitch targets (spring probes 514) onthe probe-mounting plate 524.

Probe-mounting plates are well known in the art; one such plate being aprobe-mounting plate made of glass-reinforced epoxy. Personality pins528 are embedded on a second side of the probe-mounting plate 524 andthe personality pins are electrically connected to the spring probes 514by wires 530. The wirewrap posts 532 of the personality pins 528 passthrough holes in an alignment plate 534 to make contact with interfaceprobes 500 to the tester (not shown). Interface probes 500 of the testerare in a predetermined fixed, regularly spaced pattern. The alignmentplate 534 aligns the wirewrap posts 532 of personality pins 528 tocorrespond to the predetermined location of the interface probes 500.The second major assembly 542 of the first embodiment is the unit of theprobe-mounting plate 524 containing spring probes 514 and personalitypins 528 and the alignment plate 534 which aligns the wirewrap posts 532of the personality pins 528 with the interface probes 500.

Accurate alignment of the test fixture is essential for reliableoperation. Alignment for the printed circuit board 518 to the translatorfixture 540 is maintained by means of tooling pins (not shown), which iswell known in the art of board test. Alignment between the translatorfixture 540 and the probe-mounting plate 524 is maintained by means ofalignment pins (not shown) or other known means. Alignment between thealignment plate 534 and the interface probes 500 is controlled throughthe mounting and locking hardware well known in the art of loaded-boardtest.

The method of operation of the test fixture is as follows. Thetranslator assembly 540 is mounted on the probe-mounting plate/alignmentplate assembly 542. The entire fixture, which includes the translatorfixture 540 and the probe-mounting plate/alignment plate assembly 542 isthen mounted on the regularly spaced interface probes 500 on the tester.Next the loaded printed circuit board 518 to be tested is placed on thetranslator fixture assembly 540 by means of tooling pins (not shown).The test targets 520 of the loaded-printed circuit board 518 are thenbrought into contact with the leaning probes 526 of the translatorfixture assembly 540 by any of several known means, including vacuum,pneumatic or mechanical actuating means. As the printed circuit board518 is drawn toward the tester (not shown), the leaning probes 526 aresandwiched between the test targets 520 of the printed circuit board 518and the spring probes 514, thus making a good, low-resistance contactbetween the tips of leaning probes 526 and test targets 520. The springforce of the spring probes 514 helps the tips of leaning probes 526 makea good contact with the test sites 520, even if there is flux residueleft on the printed circuit board due to current no-clean, loaded-boardmanufacturing processes. Once electrical contact between the DUT and theleaning probes 526 is established, in-circuit or functional testing maycommence.

The test fixture of the second embodiment comprises two majorassemblies. The first assembly 546 is a translator fixture comprising aseries of vertically spaced-apart and parallel guide plates 516, whichare supported in parallel by solid posts 522 that hold the fixturetogether as a solid unit. The fixture 546 also includes an array oftranslator pins such as leaning probes 526 extending through guide holesin the translator plates 516. The leaning probes 526 are in alignment ona first side of the translator fixture with test targets 520 on printedcircuit board 518. The leaning probes 526 are in alignment on a secondside of the translator fixture 546 with double-headed spring probes 508on a first side of a probe-mounting plate 506.

Double-headed spring probes 508 extend through a second side of theprobe-mounting plate 506 and make electrical contact with contact pads512 on a wireless interface printed circuit board (WIPCB) 502. Thecontact pads 512 on the first side of the PCB 502 are electricallyconnected to contact targets 504 on a second side of the PCB 502.Contact targets 504 on the second side of the wireless interface PCB 502are patterned to correspond with interface probes 500 of the tester (notshown). Interface probes 500 of the tester are in a predetermined fixed,regularly spaced pattern. The wireless interface PCB 502 allows thedouble-sided spring probes 508 to correspond to predetermined locationsof the interface probes 500 by means of copper traces from the contactpads 512 that correspond to the locations of the double-headed springprobes 508 to contact targets 504 that correspond to the locations ofthe interface probes 500 of the tester. The second major assembly 548 ofthe second embodiment is the unit of the probe-mounting plate 506containing double-sided spring probes 508 and the wireless interface PCB502 which aligns the double-sided spring probes 508 with the interfaceprobes 500.

Alignment for the printed circuit board 518 to the translator fixture546 is maintained by means of tooling pins (not shown), which is wellknown in the art of board test. Alignment between the translator fixture546 and the probe-mounting plate 506 is maintained by means of alignmentpins (not shown) or other known means. Alignment between theprobe-mounting plate 506 and the wireless interface PCB 502 ismaintained by means or alignment pins (not shown) or by other knownmeans. Alignment between the wireless, interface PCB 502 and theinterface probes 500 is controlled through mounting and locking hardwarewell known in the art of loaded-board test.

The method of operation of the test fixture is as follows. Thetranslator assembly 546 is mounted on the probe-mounting plate/interfacePCB assembly 548. The entire fixture, which includes the translatorassembly 546 and the probe-mounting plate/interface PCB assembly 548 isthen mounted on the regularly spaced interface probes 500 on the tester.Next the loaded printed circuit board 518 to be tested is placed on thetranslator fixture assembly 546 by means of tooling pins (not shown).The test targets 520 of the loaded-printed circuit board 518 are thenbrought toward the tester by any of several known means, includingvacuum, pneumatic or mechanical actuating means. As the printed circuitboard 518 is drawn toward the tester, the leaning probes 526 aresandwiched between the test targets 520 of the printed circuit board 518and the double-headed spring probes 508, thus making a good,low-resistance contact between the tips of leaning probes 526 and testtargets 520. The spring force of the double-headed spring probes 508helps the tips of leaning probes 526 make a good contact with the testsites 520, even if there is flux residue left on the printed circuitboard due to current no-clean loaded-board manufacturing processes.

Referring to the schematic block diagram of FIG. 6, a third embodimentof a loaded-board, guided-probe test fixture of the present invention isshown. Most of the components and features of FIG. 6 are similar to thecomponents and features of FIG. 5, are numbered with the same numbers asin FIG. 5, and will not be explained again. The major difference betweenthe embodiments of FIG. 5 and the embodiments of FIG. 6 are thedifferent types of test probes that are used as will be explained below.

The test fixture of the third embodiment comprises two major assemblies.The first assembly 640 is a translator fixture, similar to assembly 540in FIG. 5, comprising a series of vertically spaced-apart and parallelguide plates 516, which are supported in parallel by solid posts 522that hold the fixture together as a solid unit. The fixture alsoincludes an array of various long, leaning or vertical, test probesextending through guide holes in the translator guide plates 516. Thetest probes are in alignment on a first side of the translator fixture640 with test targets 520 of loaded circuit board 518. The test probesare in alignment on a second side of the translator fixture 640 withlarger-pitch targets on a first side of a probe-mounting plate 524.

Personality pins 528 are embedded on a second side of the probe-mountingplate 524 and personality pins 528 are electrically connected to thevarious test probes by wires 530. The wirewrap posts 532 of thepersonality pins 528 pass through holes in an alignment plate 534 tomake contact with interface probes 500 to the tester (not shown).Interface probes 500 of the tester are in a predetermined fixed,regularly spaced pattern. The alignment plate 534 aligns the wirewrapposts 532 of personality pins 528 to correspond to the predeterminedlocation of the interface probes 500. The second major assembly 642 ofthe third embodiment is the unit of the probe-mounting plate 524containing the various test probes and personality pins 528 and thealignment plate 534 which aligns the wirewrap posts 532 of thepersonality pins 528 with the interface probes 500.

Limited-access targets 520 are accessed by any of various types of long,leaning or vertical test probes 600, 604, 608, 612, 620, 622, 626, 650,652, 656, 660, 664, and 690 that extend through holes in the guideplates 516. The long test probes 600, 604, 608, 612, 620, 622, 626, 650,652, 656, 660, 664, and 690 are used to facilitate an easy transitionfrom the fine-pitch targets 520 on the device under test 518 andlarger-pitch targets on the probe-mounting plate 524 that are used toelectrically connect test probes 600, 604, 608, 612, 620, 622, 626, 650,652, 656, 660, 664, and 690 to personality pins 528 in theprobe-mounting plate 524. Probe-mounting plates are well known in theart; one such plate being a glass-reinforced epoxy probe-mounting plate.

Long-socket spring test probe 600 includes a plunger 602 extending froma very long socket/barrel that is installed in probe-mounting plate 524vertically or at an angle and extending through holes in guide plates516. Press rings 676 may be located at the base of the socket installedin probe-mounting plate 524. Press rings 676 help keep the socket oftest probe 600 securely in probe-mounting plate 524. The tip of plunger602 corresponds to the location of a corresponding test target 520 inDUT 518. The long socket of test probe 600 contains a spring force meansto hold the tip of plunger 602 in compressive contact with acorresponding test target 520 of DUT 518 when DUT 518 is brought intocompressive contact therewith. A wirewrap post 678 of test probe 600extends through probe-mounting plate 524 from a fist side facingtranslator fixture 640 to a second side facing alignment plate 534.Wirewrap post 678 of test probe 600 is electrically connected to acorresponding personality pin 528 on the second side of probe-mountingplate 524 by means of wirewrap 530. Also, the socket of test probe 600can be installed at specific predetermined depths within theprobe-mounting plate 524 in order to accommodate unique probe and targetgeometries and heights.

Short-socket spring test probe 604 includes a very long plungerextending from a short socket/barrel 606 installed vertically inprobe-mounting plate 524. The plunger may sit vertically or at an anglewith respect to the socket 606. The plunger of test probe 604 extendsthrough holes in guide plates 516. The tip of test probe 604 correspondsto the location of a corresponding test target 520 on DUT 518. Pressrings 680 help keep the socket 606 securely mounted in probe-mountingplate 524. A wirewrap post 682 of socket 606 extends throughprobe-mounting plate 524 from the first side to the second side.Wirewrap post 682 of test probe 604 is electrically connected to acorresponding personality pin 528 on the second side of probe-mountingplate 524 by means of wirewrap 530. Socket 606 contains a spring forcemeans to hold the tip of the plunger in compressive contact with acorresponding test target 520 when the DUT 518 is brought intoengagement therewith. Also, the socket 606 of test probe 604 can beinstalled at specific predetermined depths within the probe-mountingplate 524 in order to accommodate unique probe and target geometries andheights.

Test probe 608 includes a solid plunger extending from within aself-actuating spring probe that includes socket/barrel 610 with aspring force means inside of it. Test probe 608 sits atop acorresponding personality peg 672 that is installed in probe-mountingplate 524. The solid plunger extends through holes in guide plates 516.The tip of the plunger corresponds to the location of a correspondingtest target 520 on DUT 518. Personality peg 672 extends through theprobe-mounting plate 524 from the first side which faces the translatorfixture 640 to a second side which faces alignment plate 534.Personality peg 672 is electrically connected to personality pin 528 onthe second side of the probe-mounting plate 524 by means of wirewrap530.

Test probe 612 includes a plunger 614 extending from a long sockethaving a flat, rounded or pointed end 684 that sits atop a correspondingshortwire personality peg 672. The long socket extends through holes inguide plates 516. The tip of plunger 614 corresponds to the location ofa corresponding test target 520 on DUT 518. The long socket includes aspring means that holds the tip of plunger 614 in compressive contactwith the corresponding test target 520 when the DUT 518 is brought intocontact therewith. Personality peg 672 extends through probe-mountingplate 524 from the first side to the second side. Personality peg 672 iselectrically connected to personality pin 528 on the second side ofprobe-mounting plate 524 by means of wirewrap 530.

Test probe 620 includes a long plunger extending through guide plates516 from a first side of double-sided socket/barrel 616. Test probe 620also includes a short plunger 618 extending from a second side ofdouble-headed socket 616 and sitting atop a corresponding shortwirepersonality peg 672. Double-headed socket 616 includes a spring forcemeans that holds the tip of the plunger of test probe 620 in compressivecontact with a corresponding test target 520 and the tip of plunger 618in compressive contact with personality peg 672 when the DUT 518 isbrought into contact therewith. Personality peg 672 extends throughprobe-mounting plate 524 from the first side to the second side.Personality peg 672 is electrically connected to personality pin 528 onthe second side of probe-mounting plate 524 by means of wirewrap 530.

Test probe 622 includes a solid plunger extending from within awaffle-ended socket/barrel 624 which rests atop a personality post 674installed in probe-mounting plate 524. Waffle-ended socket 624 includesa spring force means for holding the tip of the plunger in compressivecontact with a corresponding test target 520 when the DUT 518 is broughtinto contact therewith. Personality post 674 extends through theprobe-mounting plate 524 from the first side which faces the translatorfixture 640 to a second side which faces alignment plate 534.Personality post 674 is electrically connected to its correspondingpersonality pin 528 on the second side of the probe-mounting plate 524by means of wirewrap 530.

Test probe 626 includes a solid probe resting atop and actuated by aspring probe 638 installed in probe-mounting plate 524. Spring probe 638contains a spring force means for holding the tip of the solid probe incompressive contact with a corresponding test target 520 when DUT 518 isbrought into contact therewith. Spring probe 638 extends through theprobe-mounting plate 524 from the first side which faces the translatorfixture 640 to a second side which faces alignment plate 534. Springprobe 638 is electrically connected to its corresponding personality pin528 on the second side of the probe-mounting plate 524 by means ofwirewrap 530. Spring probe 638 may also include press rings as describedabove with respect to test probes 600 and 604.

Test probe 650 includes a solid plunger with a built-in spring 636. Testprobe 650 is a single unit and lacks a housing or socket. Test probe 650sits atop a corresponding shortwire personality peg 672 and extendsthrough holes in guide plates 516. A tip of test probe 650 is held incompressive contact with a corresponding test target 520 of DUT 518 bythe spring force of spring 636 when the DUT 518 is brought into contacttherewith. Personality peg 672 extends through probe-mounting plate 524from the first side to the second side. Personality peg 672 iselectrically connected to personality pin 528 on the second side ofprobe-mounting plate 524 by means of wirewrap 530.

Test probe 652 includes a plunger 654 extending from a first side of along, double-sided socket. Test probe 652 also includes a short plunger686 extending from a second side of the double-sided socket and sittingatop a corresponding personality peg 672. The double-sided socketincludes a spring force means that compressively holds test probe 652between test target 520 and personality peg 672 when DUT 518 is broughtinto compressive contact therewith. Personality peg 672 extends throughprobe-mounting plate 524 from the first side to the second side.Personality peg 672 is electrically connected to personality pin 528 onthe second side of probe-mounting plate 524 by means of wirewrap 530.

Test probe 656 includes a solid probe resting atop a spring probe 658that rests atop a corresponding personality peg 672. It should be notedthat since neither the solid probe nor the spring probe 658 areinstalled in probe-mounting plate 524, the solid probe must extendthrough at least two guide plates 516 and the spring probe 658 mustextend through at least two guide plate 516 in order to effectivelymaintain the position of test probe 656. The tip of the solid probe oftest probe 656 is held in compressive contact with a corresponding testtarget 520 by the spring force of spring probe 658 when DUT 518 isbrought into contact therewith. Personality peg 672 extends throughprobe-mounting plate 524 from the first side to the second side.Personality peg 672 is electrically connected to personality pin 528 onthe second side of probe-mounting plate 524 by means of wirewrap 530.

Test probe 660 includes a plunger 662 extending from a first side of along socket. Test probe 660 also includes a wirewrap tail 688 extendingfrom a second side of the socket and sitting atop a correspondingpersonality peg 672. The socket includes a spring force means thatcompressively holds test probe 660 between test target 520 and contactpersonality peg 672 when DUT 518 is brought into compressive contacttherewith. Personality peg 672 extends through probe-mounting plate 524and is electrically connected to personality pin 528 by means ofwirewrap 530.

Test probe 664 comprises a flexible, solid probe that extends throughholes in guide plates 516. Test probe 664 has a first end that contactsa corresponding test target 520 on DUT 518 and a second end thatcontacts a corresponding personality peg 672 on probe-mounting plate524. The holes in guide plates 516 are located at predeterminedlocations such that when test probe 664 is in compressive contact with acorresponding test target 520 of DUT 518 and a corresponding personalitypeg 672 of probe-mounting plate 524, test probe 664 will bendcompressively, but maintain contact with its corresponding test target520 and personality peg 672. Personality peg 672 of test probe 664extends through probe-mounting plate 524 and is electrically connectedto its corresponding personality pin 528 by means of wirewrap 530.

Test probe 690 includes a long, solid probe having a tip at a first endthat contacts a corresponding test target 520 on DUT 518 and a ball 692at a second end that mates with a plunger 694 of spring probe 696mounted in probe-mounting plate 524. Spring probe 696 contains a springforce means to hold the tip of the probe in compressive contact with acorresponding test target 520 when the DUT 518 is brought intocompressive contact therewith. Spring probe 696 extends throughprobe-mounting plate 524 and is electrically connected to itscorresponding personality pin 528 by means of wirewrap 530.

The test probes 600, 604, 608, 612, 620, 622, 626, 650, 652, 656, 660,664, and 690 are in alignment on the first side of the translatorfixture 640 with test targets 520 of loaded-circuit board under test518. The test probes 600, 604, 608, 612, 620, 622, 626, 650, 652, 656,660, 664, and 690 are in alignment on the second side of the translatorfixture 640 with larger- pitch targets.

Alignment of the DUT 518 to the translator fixture 640 is maintained bymeans of tooling pins (not shown), which is well known in the art ofboard test. Alignment between the translator fixture 518 and theprobe-mounting plate 524 is maintained by means of alignment pins (notshown) or other known means. Alignment between the alignment plate 534and the interface probes 500 is controlled through the mounting andlocking hardware well known in the art of loaded-board test.

The method of operation of the test fixture is as follows. Thetranslator assembly 640 is mounted on the probe-mounting plate/alignmentplate assembly 642. The entire fixture, which includes the translatorfixture 640 and the probe-mounting plate/alignment plate assembly 642 isthen mounted on the regularly spaced interface probes 500 on the tester.Next the loaded printed circuit board 518 to be tested is placed on thetranslator fixture assembly 640 by means of tooling pins (not shown).The test targets 520 of the loaded-printed circuit board 518 are thenbrought into contact with the test probes 600, 604, 608, 612, 620, 622,626, 650, 652, 656, 660, 664, and 690 of the translator fixture assembly640 by any of several known means, including vacuum, pneumatic ormechanical actuating means.

As the printed circuit board 518 is drawn toward the tester (not shown),the test probes 600, 604, 608, 612, 620, 622, 626, 650, 652, 656, 660,664, and 690 are sandwiched between the test targets 520 of the DUT 518and probe-mounting plate 524, thus making a good, low-resistance contactbetween the tips of the test probes 600, 604, 608, 612, 620, 622, 626,650, 652, 656, 660, 664, and 690 and the limited-access test targets520. The wiping action of tips of leaning test probes 600, 604, 608,612, 620, 622, 626, 650, 652, 656, 660, 664, and 690 across the targets520 and the spring force of the various test probe 600, 604, 608, 612,620, 622, 626, 650, 652, 656, 660, 664, and 690 helps the tips of testprobes 600, 604, 608, 612, 620, 622, 626, 650, 652, 656, 660, 664, and690 make a good contact with the test targets 520, even if there is fluxresidue left on the printed circuit board due to current no-clean,loaded-board manufacturing processes. Once electrical contact betweenthe DUT and the various corresponding test probes is established,in-circuit or functional testing may commence.

There are actually two anticipated methods to initiate full electricalcontact between the test targets and the interface probes on the tester.One method involves placing the DUT 518 directly on the tips of the testprobes and then pushing the DUT 518 and the guide plates 522 toward theprobe-mounting plate/alignment plate assembly 642, where the translatorfixture unit 640 and the probe-mounting plate/alignment plate unit 542of the fixture are aligned with tooling pins, but can move in thevertical direction in relation to each other. The second method involvesplacing the DUT 518 directly on the tips of the test probes and thenpushing the DUT 518 towards the entire fixture, where the translatorportion 640 and the probe-mounting plate/alignment plate portion 642 arefixedly secured to one another by spacers (not shown). As the DUT 518 isbrought into compressive contact with the test fixture, the spring forceof the various test probes will maintain compressive contact betweeneach of the test probes and its corresponding test target 520,regardless of the varying height and geometries of the different testtargets 520 of DUT 518.

The proposed test fixture of the present invention can probe a mixtureof standard-access and limited-access targets 534. Long, leaning orvertical test probes 600, 604, 608, 612, 620, 622, 626, 650, 652, 656,660, 664, and 690 guide plates 522 and limited probe tip travel improvethe test fixture's ability to probe small, fine-pitch targets 520.Personality pins 528 and alignment plate 534 provide complex testerresource allocation.

Referring to FIG. 7, the test fixture of the fourth embodiment comprisestwo major assemblies. The first assembly 746 is a translator fixture,similar to assembly 546 in FIG. 5, comprising a series of verticallyspaced-apart and parallel guide plates 516, which are supported inparallel by solid posts 522 that hold the fixture together as a solidunit. The fixture also includes an array of various long, leaning orvertical, test probes extending through guide holes in the translatorplates 516. The test probes are in alignment on a first side of thetranslator fixture 746 with test targets 520 of loaded circuit board518. The test probes are in alignment on a second side of the translatorfixture 746 with larger-pitch contact pads 512 on a first side of awireless interface printed circuit board (WIPCB) 502.

The contact pads 512 on wireless interface printed circuit board 502 areelectrically connected to contact targets 504 on a second side of theWIPCB 502. Contact targets 504 on the second side of WIPCB 502 arepatterned to correspond with interface probes 500 of the tester (notshown). Interface probes 500 of the tester are in a predetermined fixed,regularly spaced pattern. The WIPCB 502 allows the variouslimited-access test probes to correspond to predetermined locations ofthe interface probes 500 by means of copper traces (not shown) from thecontact pads 512 that correspond to the locations of the test probes tothe contact targets 504 that correspond to the locations of theinterface probes 500 of the tester. The second major assembly 748 of thefourth embodiment of the present invention is the wireless interfaceprinted circuit board 502 which aligns the limited-access test probeswith the interface probes 500.

Limited-access targets 520 are accessed by any of various types of long,leaning or vertical test probes 708, 712, 720, 722, 750, 752, 756, 760,and 764 that extend through holes in guide plates 516. The test probes708, 712, 720, 722, 750, 752, 756, 760, and 764 are used to facilitatean easy transition from the fine-pitch targets 520 on the device undertest 518 to the larger-pitch targets 512 on the WIPCB 502 that areelectrically connected to contact pads 504 via copper traces (notshown).

Test probe 708 includes a solid plunger extending from within aself-actuating spring probe that includes socket 710 with a spring forcemeans inside of it. Test probe 708 sits atop a corresponding contact pad512 on WIPCB 502. The tip of the solid plunger of test probe 708 is heldin compressive contact with a corresponding test target 520 by thespring force means in socket 710 when DUT 518 is brought intocompressive contact therewith. Contact pad 512 is electrically connectedto contact target 504 on the second side of the WIPCB 502 by means of acopper trace (not shown).

Test probe 712 includes a plunger 714 extending from a long sockethaving a flat, rounded or pointed end 784 that sits atop a correspondingcontact pad 512 on WIPCB 502. The long socket extends through holes inguide plates 516. A tip of plunger 714 corresponds to the location of acorresponding test target 520 on DUT 518. The long socket includes aspring means that holds the tip of plunger 714 in compressive contactwith the corresponding test target 520 when the DUT 518 is brought intocompressive contact therewith. Contact pad 512 is electrically connectedto contact target 504 on the second side of the WIPCB 502 by means of acopper trace (not shown).

Test probe 720 includes a long plunger extending through guide plates516 from a first side of double-headed socket/barrel 716. Test probe 720also includes a short plunger 718 extending from a second side ofdouble-headed socket 716 and sitting atop a corresponding contact pad512 on WIPCB 502. Double-headed socket 716 includes a spring force meansthat holds the tip of the plunger of test probe 720 in compressivecontact with a corresponding test target 520 and the tip of plunger 718in compressive contact with its corresponding contact pad 512 on WIPCB502 when the DUT 518 is brought into compressive contact therewith.Contact pad 512 is electrically connected to contact target 504 on thesecond side of the WIPCB 502 by means of a copper trace (not shown).

Test probe 722 includes a solid plunger extending from within awaffle-ended socket/barrel 724 which rests atop a contact pad 512 onWIPCB 502. Waffle-ended socket 724 includes a spring force means forholding the test probe 722 in compressive contact between itscorresponding test target 520 and its corresponding contact pad 512 onthe WIPCB 502 when the DUT 518 is brought into compressive contacttherewith. Contact pad 512 is electrically connected to contact target504 on the second side of the WIPCB 502 by means of a copper trace (notshown).

Test probe 750 includes a plunger with a built-in spring 736. Test probe750 is a single unit and lacks a housing or socket. Test probe 750 sitsatop a corresponding contact pad 512 on WIPCB 502 and extend s throughholes in guide plates 516. Test probe 750 is held in compressive contactbetween its corresponding test target 520 of DUT 518 and itscorresponding contact pad 512 on WIPCB 502 by the spring force of spring736 when the DUT 518 is brought into compressive contact therewith.Contact pad 512 is electrically connected to contact target 504 on thesecond side of the WIPCB 502 by means of a copper trace (not shown).

Test probe 752 includes a plunger 754 extending from a first side of along, double-headed socket. Test probe 752 also includes a short plunger786 extending from a second side of the double-headed socket and sittingatop a corresponding contact pad 512 on WIPCB 502. The double-headedsocket includes a spring force means that compressively holds test probe752 between its corresponding test target 520 and its correspondingcontact pad 512 on WIPCB 502 when DUT 518 is brought into compressivecontact therewith. Contact pad 512 is electrically connected to contacttarget 504 on the second side of the WIPCB 502 by means of a coppertrace (not shown).

Test probe 756 includes a solid plunger resting atop a spring probe 758that rests atop a corresponding contact pad 512 on WIPCB 502. It shouldbe noted that both the solid probe and the spring probe 758 must extendthrough at least two guide plates 516 in order to securely maintain theposition of test probe 756. The tip of the solid probe of test probe 756is held in compressive contact with a corresponding test target 520 bythe spring force of spring probe 758 when DUT 518 is brought intocompressive contact therewith. Contact pad 512 is electrically connectedto contact target 504 on the second side of WIPCB 502 by means of acopper trace (not shown).

Test probe 760 includes a plunger 762 extending from a first side of along, socket. Test probe 760 also includes a wirewrap tail 788 extendingfrom a second side of the socket and sitting atop a correspondingcontact pad 512 on WIPCB 502. The socket includes a spring force meansthat compressively holds test probe 760 between its corresponding testtarget 520 and its corresponding contact pad 512 on WIPCB 502 when DUT518 is brought into compressive contact therewith. Contact pad 512 iselectrically connected to contact target 504 on the second side of WIPCB502 by means of a copper trace (not shown).

Test probe 764 comprises a flexible, solid probe that extends throughholes in guide plates 516. Test probe 764 has a first end that contactsits corresponding test target 520 on DUT 518 and a second end thatcontacts its corresponding contact pad 512 on WIPCB 502. The holes inguide plates 516 are located at predetermined locations such that whentest probe 764 is in compressive contact with its corresponding testtarget 520 of DUT 518 and its corresponding contact pad 512 on WIPCB502, test probe 764 will bend compressively, but maintain contact withits corresponding test target 520 and contact pad 512. Contact pad 512is electrically connected to contact target 504 on the second side ofWIPCB 502 by means of a copper trace (not shown).

It should be noted that other types of test probes may be used inconjunction with the fourth embodiment of the present invention. Thefourth embodiment basically pertaining to long, leaning or verticalself-actuating spring probes directed by guide plates 516 and makingelectrical contact with tester interface probes 500 by means of contactpads 512, wire traces (not shown) and contact targets 504 of a wirelessinterface printed circuit board 502.

Alignment for the printed circuit board 518 to the translator fixture746 is maintained by means of tooling pins (not shown), which is wellknown in the art of board test. Alignment between the translator fixture746 and the wireless interface PCB 502 is maintained by means ofalignment pins (not shown) or by other known means. Alignment betweenthe wireless, alignment PCB 502 and the interface probes 500 iscontrolled through mounting and locking hardware well known in the artof loaded-board testers.

The method of operation of the test fixture is as follows. Thetranslator assembly 746 is mounted on the WIPCB assembly 748. The entirefixture, which includes the translator assembly 746 and the WIPCBassembly 748 is then mounted on the regularly spaced interface probes500 on the tester. Next the loaded printed circuit board 518 to betested is placed on the translator fixture assembly 746 by means oftooling pins (not shown). The test targets 520 of the loaded-printedcircuit board 518 are then brought toward the tester by any of severalknown means, including vacuum, pneumatic or mechanical actuating means.As the printed circuit board 518 is drawn toward the tester, the testprobes are sandwiched between the test targets 520 of the printedcircuit board 518 and the contact pads 512 of the WIPCB 502, thus makinga good, low-resistance contact between the tips of test probes and testtargets 520. The wiping action of the tips of the various leaning testprobes across test targets 520 and the spring force of the test probeshelps the tips of the test probes make good contact with the test sites520, even if there is flux residue left on the printed circuit board dueto current no-clean loaded-board manufacturing processes.

Referring to the schematic block diagram of FIG. 8, a fifth and a sixthembodiment of a loaded-board, guided-probe test fixture of the presentinvention are shown. Most of the components and features of FIG. 8 aresimilar to the components and features of FIGS. 5, 6 and 7 above, arenumbered with the same numbers. The major differences between theembodiments of FIG. 8 and FIG. 5, 6 and 7 will be explained below.

The test fixture of the fifth embodiment comprises three majorassemblies. The first major assembly 840 is a translator fixturecomprising a series of vertically spaced-apart and parallel guide plates516, which are supported in parallel by solid posts 522 that hold thefixture together as a solid unit. The fixture also includes an array ofleaning probes 526 extending through guide holes in the translator guideplates 516. The leaning probes 526 are in alignment on a first side ofthe translator fixture 840 with test targets 520 of a loaded circuitboard 518. The leaning probes 526 are in alignment on a second side ofthe translator fixture 840 with double-headed spring probes 854 on afirst side of a universal interface plate 852. The long leaning probes526 are used to facilitate an easy transition from the fine-pitchtargets 520 on the device under test 518 and larger pitch targets(double-headed spring probes 854) on the universal interface plate 852,the second major assembly 850 of the fifth embodiment being theuniversal interface plate 852.

Double-headed spring probes 854 extend through a second side of theuniversal interface plate 852 and make electrical contact with eitherpersonality posts 856 or personality pegs 858 mounted in probe-mountingplate 524. Probe-mounting plates are well known in the art; one suchplate being a probe- mounting plate made of glass-reinforced epoxy.Personality posts 856 and personality pegs 858 extend through to asecond side of the probe-mounting plate 524.

Personality pins 528 are embedded on the second side of theprobe-mounting plate 524 and the personality pins 528 are electricallyconnected to at least one of the personality posts 856 or personalitypegs 858 by short wires 530. The wirewrap posts 532 of the personalitypins 528 pass through holes in an alignment plate 534 to make contactwith interface probes 500 of the tester (not shown). Interface probes500 of the tester are in a predetermined fixed, regularly spacedpattern. The alignment plate 534 aligns the wirewrap posts 532 ofpersonality pins 528 to correspond to the predetermined location of theinterface probes 500. The third major assembly 842 of the fifthembodiment is the unit of the probe-mounting plate 524 containingpersonality posts 856 and/or personality pegs 858 and personality pins528 and the alignment plate 534 which aligns the wirewrap posts 532 ofthe personality pins 528 with the interface probes 500.

Accurate alignment of the test fixture is essential for reliableoperation. Alignment for the printed circuit board 518 to the translatorfixture 840 is maintained by means of tooling pins (not shown), which iswell known in the art of board test. Alignment between the translatorfixture 840, the universal interface plate 852, and the probe-mountingplate/alignment plate assembly 842 is maintained by means of alignmentpins (not shown) or other known means. Alignment between the alignmentplate 534 and the interface probes 500 is controlled through themounting and locking hardware well known in the art of loaded-boardtest.

The method of operation of the test fixture is as follows. Thetranslator assembly 840 is mounted on the universal interface plate 852which is mounted on the probe-mounting plate/alignment plate assembly542. The entire fixture, which includes the translator fixture 840, theuniversal interface plate 852, and the probe-mounting plate/alignmentplate assembly 842 is then mounted on the regularly spaced interfaceprobes 500 on the tester. Next the loaded printed circuit board 518 tobe tested is placed on the translator fixture assembly 840 by means oftooling pins (not shown). The test targets 520 of the loaded-printedcircuit board 518 are then brought into contact with the leaning probes526 of the translator fixture assembly 840 by any of several knownmeans, including vacuum, pneumatic or mechanical actuating means.

As the printed circuit board 518 is drawn toward the tester (not shown),the leaning or vertical probes 526 are sandwiched between the testtargets 520 of the printed circuit board 518 and the double-headedspring probes 854, thus making a good, low-resistance contact betweenthe tips of leaning probes 526 and test targets 520. The wiping actionof the tips of the leaning, solid probes across the test targets 520 andthe spring force of the spring probes 854 helps the tips of leaningprobes 526 make a good contact with the test sites 520, even if there isflux residue left on the printed circuit board due to current no-clean,loaded-board manufacturing processes. Once electrical contact betweenthe DUT and the leaning probes 526 is established, in-circuit orfunctional testing may commence.

The test fixture of the sixth embodiment comprises three majorassemblies. The first assembly 840 is a translator fixture comprising aseries of vertically spaced-apart and parallel guide plates 516, whichare supported in parallel by solid posts 522 that hold the fixturetogether as a solid unit. The fixture 840 also includes an array oftranslator pins such as leaning or vertical probes 526 extending throughguide holes in the translator plates 516. The leaning or vertical probes526 are in alignment on a first side of the translator fixture with testtargets 520 on printed circuit board 518. The leaning or vertical probes526 are in alignment on a second side of the translator fixture 840 withdouble-headed spring probes 854 on a first side of a universal interfaceplate 852. The second major assembly of the sixth embodiment being theuniversal interface plate 852.

Double-headed spring probes 854 extend through a second side of theuniversal interface plate 852 and make electrical contact with contactpads 512 on a wireless interface printed circuit board (WIPCB) 502. Thecontact pads 512 on the first side of the PCB 502 are electricallyconnected to contact targets 504 on a second side of the PCB 502.Contact targets 504 on the second side of the WIPCB 502 are patterned tocorrespond with interface probes 500 of the tester (not shown).Interface probes 500 of the tester are in a predetermined fixed,regularly spaced pattern. The wireless interface PCB 502 allows thedouble-headed spring probes 854 to correspond to the predeterminedlocations of the interface probes 500 by means of copper traces from thecontact pads 512 that correspond to the locations of the double-headedspring probes 854 to contact targets 504 that correspond to thelocations of the interface probes 500 of the tester. The third majorassembly 548 of the sixth embodiment is the unit of the WIPCB 502 whichaligns the double-headed spring probes 508 with the interface probes500.

Alignment for the printed circuit board 518 to the translator fixture840 is maintained by means of tooling pins (not shown), which are wellknown in the art of board test. Alignment between the translator fixture840 and the universal interface plate 854 is maintained by means ofalignment pins (not shown) or other known means. Alignment between theuniversal interface plate 854 and the wireless interface PCB 502 ismaintained by means or alignment pins (not shown) or by other knownmeans. Alignment between the wireless, alignment PCB 502 and theinterface probes 500 is controlled through mounting and locking hardwarewell known in the art of loaded-board test.

The method of operation of the test fixture is as follows. Thetranslator assembly 840 is mounted on the universal interface plate850/WIPCB assembly 848. The entire fixture, which includes thetranslator assembly 840 and the universal interface plate 850/WIPCBassembly 848 is then mounted on the regularly spaced interface probes500 on the tester. Next the loaded printed circuit board 518 to betested is placed on the translator fixture assembly 840 by means oftooling pins (not shown). The test targets 520 of the loaded-printedcircuit board 518 are then brought toward the tester by any of severalknown means, including vacuum, pneumatic or mechanical actuating means.As the printed circuit board 518 is drawn toward the tester, the leaningor vertical, solid probes 526 are sandwiched between the test targets520 of the printed circuit board 518 and the double-headed spring probes854, thus making a good, low-resistance contact between the tips ofleaning or vertical, solid probes 526 and test targets 520. The wipingaction of the leaning, solid probes 526 across the test targets 520 andthe spring force of the double-headed spring probes 854 helps the tipsof leaning probes 526 make a good contact with the test sites 520, evenif there is flux residue left on the printed circuit board due tocurrent no-clean loaded-board manufacturing processes.

The foregoing description of the present invention has been presentedfor purposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form disclosed, andother modifications and variations may be possible in light of the aboveteachings. For example, the translator fixture could be milled out toaccommodate even more types of test probes, such as the largercapacitive and inductive type test probes. Also, two guided-probe testfixtures could be used in a clamshell type tester in order to testprinted circuit boards that are populated with electronic components onboth sides or have test targets on both sides.

Still further, the guided-probe test fixture of the present inventioncould be used in conjunction with an automatic tester in order to testprinted circuit boards that are populated with electronic components onboth sides or have test targets on both sides. The embodiment was chosenand described in order to best explain the principles of the inventionand its practical application to thereby enable others skilled in theart to best utilize the invention in various embodiments and variousmodifications as are suited to the particular use contemplated. It isintended that the appended claims be construed to include otheralternative embodiments of the invention except insofar as limited bythe prior art.

What is claimed is:
 1. A guided-probe test fixture for electricallyconnecting one or more limited-access test targets on a loaded circuitboard under test with interface probes of a tester, said guided-probetest fixture comprising:a) one or more long, solid test probes; b) aplurality of substantially parallel guide plates having a first side anda second side, said plurality of substantially parallel guide plateshaving through holes in predetermined locations, such that each of saidone or more long, solid test probes extends through said through holesin said guide plates and line up with a corresponding one of said one ormore limited-access test targets on said first side of said guideplates; c) a probe-mounting plate on said second side of said guideplates between said plurality of guide plates and said interface probesof said tester when said guided-probe test fixture is mounted on saidtester; d) one or more spring probes mounted in said probe-mountingplate, wherein each of said plurality of spring probes lines-up with acorresponding one of said long, solid test probes on said second side ofsaid guide plates; e) one or more personality pins having wire wrapposts mounted in said probe-mounting plate, each of said personalitypins being electrically connected to at least one of said spring probesby means of wire wrap between said spring probes and said wire wrapposts; and f) an alignment plate, said wire wrap posts of saidpersonality pins extending through said alignment plate in such a mannerthat each of said wire wrap posts lines-up with a correspondinginterface probe of said tester when said guided-probe test fixture ismounted on said tester.